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Direct Bond Copper Substrate

DBC Substrate for Electronic

Specifications

1 Small Size

2.Lightweight

3.Hardness

4.All shape customized

5.Coating by Cu ,Mo/Mn,Ag

6.Thickness : 0.25mm,0.28mm,0.45mm,0.5mm,0.635mm,1.0mm,1.5mm, 1.8mm,2.0mm

Details

  • Xiamen, Fujian, China
  • Xiamen Innovacera Advanced Materials Co., Ltd

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