#Product Trends
Direct Bond Copper Substrate
DBC Substrate for Electronic
Specifications
1 Small Size
2.Lightweight
3.Hardness
4.All shape customized
5.Coating by Cu ,Mo/Mn,Ag
6.Thickness : 0.25mm,0.28mm,0.45mm,0.5mm,0.635mm,1.0mm,1.5mm, 1.8mm,2.0mm