DMP305X Design (2) -- Monosilicon Pressure Sensor

Monosilicon Pressure Sensor

DMP305X monosilicon pressure transmitter is a high performance pressure transmitter with international leading technology meticulously designed by LEEG instrument, using the world's most advanced sensor technology and patent encapsulation technology. The sensor locates on the top of the metal body and stay away from the medium interface to realizes mechanical isolation and thermal isolation. Glass sintering sensor wire realizes high strength electrical insulation of metal base and improves the capability of flexibility of electronic circuit and transient voltage resistance protection.

(Figure: The clean packaging of monosilicon pressure sensor sensitive components)

Principle

Monosilicon sensor using Micro-Electro-Mechanical System technology (MEMS). High and low pressure transfer to the silicon-sensitive components through the isolation diaphragm and filling fluid, the Wheatstone bridge unbalanced and resistance value changes when pressuring, adopt current excitation, and transfer to a linear voltage output corresponding to the differential pressure.

Fully-isolated monosilicon pressure sensor, excellent anti-interference performance

Monsilicon sensor sensing element is mounted inside the sensor capsule, measuring pressure transfer through the isolation diaphragm and filling fluid, so as to achieve a fully isolated packaging, to avoid being affected by measurement and environmental temperature changes, electrical interference and mechanical vibration

High-frequency response

Monosilicon material with excellent performance, the inherent resonant frequency is more than 500Hz. It’s immediately converted to signal output when the pressure is transmitted to the sensing element. The overall response time is no more than 5mS, suitable for high-frequency dynamic applications.

Strong anti-overload capability

Double overload protection technology, the center diaphragm and isolated diaphragm compose of dual overload protection. In normal measurement, isolated diaphragm contact pressure deformation, filling fluid transfer to the center diaphragm and sensitive components.

The isolated diaphragm has the same corrugation structure with the sensor capsule. When the high and low pressure is excessively high, the central diaphragm is deformed under high pressure, so as to avoid the excessive filling liquid being transmitted to the sensitive component, and the isolated diaphragm is completely closed to the sensor capsule, even if the pressure continues to increase, the filling fluid is no longer passed to the sensitive components, so as to achieve the overload protection. Monosilicon material has excellent elastic properties, it does not affect the measurement while return to normal.